After the obvious problems encountered on Xperia Z3 Plus/Xperia Z4, caused by the adoption of Snapdragon 810, Sony has decided to play the card again in the top of the range home Qualcomm for its new Xperia Z5. According to the first teardown Xperia Z5 Premium, it seems that Sony has taken seriously the problem of excessive heat produced by Snapdragon 810, coming to adopt a solution taken directly from PC world, namely thermal paste and a heat sink. For the moment it is not clear whether this solution is also equipped on Xperia Z5and Xperia Z5 Compact, although the first version Compact behaviors, from China, they don’t seem very positive.
According to the findings, in fact, the terminal would suffer from obvious problems of overheating, leading to poor user experience when they are critical temperatures. Obvious lag, low reactivity or even total lack of response from the touch screen are just some of the key behaviors that emerged during the various tests. It seems that Sony is about to release anUpdate aimed at containing these issues and this will happen, of course, through a reduction of SoC, clock solution already undertaken by almost all manufacturers that adopt Snapdragon 810.
Ultimately using Snapdragon 808, definitely less powerful but much more stable, would have led to a new generation of compact Sony Home both for performance and for consumption.
Sony Xperia Z5 Compact is available online from ePRICE to 351 euros. The value for money isdiscreet. There are 17 best models.